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| 1. general description the TFA9881 is a mono, filter-free class-d audio amplifier in a 9-bump wlcsp (wafer level chip-size package) with a 400 ? m pitch. the digital input interface is an over-sampl ed pulse density modulated (pdm) bit stream. the TFA9881 receives audio and control settin gs via this interface. dedicated silence patterns are used to configure the control settin gs of the device, such as mute, gain, pulse width modulated (pwm) output slope, clip co ntrol and bandwidth ex tension (this control mechanism is not required if the default se ttings are used). the power-down to operating mode transition is triggered when a clock signal is detected. the device features low rf susceptibility because it has a digi tal input interface that is insensitive to clock jitter. the second order closed loop architecture used in the TFA9881 provides excellent audio performance and high supply voltage ripple rejection. 2. features and benefits ? small outline wlcsp9 package: 1.3 ? 1.3 ? 0.6 mm ? wide supply voltage range (fully operational from 2.5 v to 5.5 v) ? high efficiency (90 %, 4 ?/20 ? h load) and low power dissipation ? quiescent power: ? 6.5 mw (v ddd = 1.8 v, v ddp = 3.6 v, 4 ? /20 ? h load, f clk = 2.048 mhz) ? 7.8 mw (v ddd = 1.8 v, v ddp = 3.6 v, 4 ? /20 ? h load, f clk = 6.144 mhz) ? output power: ? 1.4 w into 4 ? at 3.6 v supply (thd = 1 %) ? 2.7 w into 4 ? at 5.0 v supply (thd = 1 %) ? 3.4 w into 4 ? at 5.0 v supply (thd = 10 %) ? output noise voltage: 24 ? v (a-weighted) ? signal-to-noise ratio: 103 db (v ddp = 5 v, a-weighted) ? fully short-circuit proof across load and to supply lines ? current limiting to avoid audio holes ? thermally protected ? undervoltage and overvoltage protection ? high-pass filter for dc blocking ? invalid data protection ? simple two-wire interface for audio and control settings ? left/right selection ? three gain settings: ?? 3db, 0db and +3db ? pwm output slope setting for emi reduction TFA9881 3.4 w pdm input class-d audio amplifier rev. 1 ? 5 january 2011 preliminary data sheet
TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 2 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier ? bandwidth extension to support low sampling frequencies ? clip control for smooth clipping ? mute mode ? ?pop noise' free at all mode transitions ? short power-up time: 2 ms ? short power-down time: 5 ? s ? 1.8 v/3.3 v tolerant digital inputs ? low rf susceptibility ? insensitive to input clock jitter ? only two external components required 3. applications ? mobile phones ? pdas ? portable gaming devices ? portable navigation devices (pnd) ? notebooks/netbooks ? mp3 players/portable media players 4. quick reference data [1] r l = load resistance; l l = load inductance. table 1. quick reference data all parameters are guaranteed for v test = v ddp = 3.6 v; v ddd = 1.8 v; r l = 4 ? [1] ; l l = 20 ? h [1] ; f i = 1 khz; f clk = 6.144 mhz; t amb = 25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit v ddp power supply voltage on pin v ddp 2.5 - 5.5 v v ddd digital supply voltage on pin v ddd 1.65 1.8 1.95 v i ddp power supply current operating mode with load - 1.5 1.7 ma mute mode - 1.1 1.2 ma power-down mode - 0.1 1 ? a i ddd digital supply current operating mode - 1.35 1.5 ma mute mode - 1.25 1.4 ma power-down mode clk = 0 v; data = 0 v -28 ? a p o(rms) rms output power thd + n = 1 % v ddp = 3.6 v, f i = 100 hz - 1.4 - w v ddp = 5.0 v, f i = 100 hz - 2.7 - w thd + n = 10 % v ddp = 5.0 v, f i = 100 hz - 3.4 - w ? po output power efficiency p o(rms) =1.4 w - 90 - % TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 3 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 5. ordering information 6. block diagram table 2. ordering information type number package name description version TFA9881uk wlcsp9 wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm TFA9881uk fig 1. block diagram 010aaa698 outa outb power down control h-bridge pwm c3 a3 hp filter pdm receiver data clk a1 c1 a2 lrsel silence pattern decoder v ddd test v ddp TFA9881 protection circuits: otp ovp uvp ocp gnd b1 c2 b2 b3 TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 4 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 7. pinning information 7.1 pinning 7.2 pin description fig 2. bump configuration for wlcsp9 (bottom view) fig 3. bump configuration for wlcsp9 (top view) c b a 123 010aaa700 TFA9881 bottom view bump a1 index area a b c 123 010aaa699 TFA9881 transparent top view bump a1 index area fig 4. bump mapping for wlcsp9 data lrsel outb 123 v ddd v ddp gnd a b clk test outa c 010aaa701 transparent top view table 3. pin description symbol pin type description data a1 i data input lrsel a2 i left/right selection outb a3 o inverting output v ddd b1 p digital supply voltage (1.8 v) v ddp b2 p power supply voltage (2.5 v to 5.5 v) gnd b3 p ground reference clk c1 i clock input test c2 i test pin (must be connected to v ddp ) outa c3 o non-inverting output TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 5 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 8. functional description the TFA9881 is a high-efficiency mono bridge tied load (btl) class-d audio amplifier with a digital stereo pdm input interface. a high-pass (hp) filter removes the dc components from the incoming pdm stream. th is stream is subsequently converted into two pwm signals. a 3-level pwm scheme supports filterless speaker drive. 8.1 mode selection and interfacing the TFA9881 supports four operating modes: ? power-down mode , with low supply current ? mute mode , in which the output stages are floating so that the audio input signal is suppressed ? operating mode , in which the amplifier is fully operational, de livering an output signal ? fault mode the TFA9881 switches to fault mode auto matically when a protection mechanism is activated (see section 8.6 ). the defined patterns required on the clk and data inputs to select the other three modes are given in ta b l e 4 . power-down mode is selected when there is no clock signal on the clk input. applying the clock signal will cause the TFA9881 to s witch from power-down mode to operating mode. power-down mode is also activated when the power-down silence pattern (at least 128 consecutive 0xac bytes) is detected on the data input (see section 8.4.1 ). the TFA9881 will switch to power-down mode afte r byte 128 and will rema in in power-down mode as long as a continuous stream of consecutive 0xac bytes is being received. it will switch to operating mode if a by te other than 0xac is received. mute mode is activated when the mute s ilence pattern (at leas t 32 consecutive 0x66 bytes) is detected on the da ta input. the TFA9881 will switch to mute mode after byte 32 and will remain in mute mode until a by te other than 0x66 is received. 8.2 digital stereo pdm audio input the TFA9881 supports th e digital stereo pdm stream illust rated in figure 5 . table 5 shows the pin control configuration for left and right selection. table 4. mode selection mode pins clk frequency data pattern outa, outb power-down 0 hz don?t care floating 2 mhz to 8 mhz activated after 128 consecutive 0xac bytes floating mute 2 mhz to 8 mhz activated after 32 consecutive 0x66 bytes floating operating 2 mhz to 8 mhz pdm bit stream switching TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 6 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 8.3 power up/down sequence the TFA9881 power-up/power-down sequence is shown in figure 6 . external power supplies v ddp and v ddd should be within their operating limits before the TFA9881 switches to operating mode. the TFA9881 should be switched to power-down mode before the power supplies are disconnected or turned off. [1] r l = load resistance; l l = load inductance. [2] inversely proportional to f clk . fig 5. digital ster eo pdm selection table 5. left/right selection lrsel pin state description low left content amplified high right content amplified 010aaa702 clk data left right fig 6. power-up/power-down sequence v ddp , v ddd clk 128f s or 64f s clock signal data outa , outb t d(on) power-down operating mute operating mute power-down t d(on) operating t d(off) power-down switching pdm 32 times 0x66 floating 0x66 ....... pdm switching 32 times 0xac 96 times 0xac 128 0xac floating 0xac ....... pdm switching 010aaa710 table 6. power-up/power-down timing all parameters are guaranteed for v test =v ddp = 3.6 v; v ddd = 1.8 v; r l =4 ? [1] ; l l =20 ? h [1] ; f i = 1 khz; f clk = 6.144 mhz; t amb = 25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit t d(on) turn-on delay time [2] --2ms t d(off) turn-off delay time [2] --5 ? s TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 7 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 8.4 control settings control settings are not needed if the default values are adequate. 8.4.1 silence pattern recognition the TFA9881 can detect control settings on the pdm input by means of silence pattern recognition. a silence pattern has the following properties: ? all audio bytes have the same value ? each audio byte must contain four zeros and four ones the ten silence patterns recognized by the TFA9881 are listed in the first column of ta b l e 7 . the second column contains the related audio bytes that are generated when the silence patterns are phase shifted by 1, 2, 3, 4, 5, 6 and 7 bits. the TFA9881 reacts as follows on receiving a silence pattern (see ta b l e 8 ): ? after receiving 32 consecutive silence patt ern audio bytes, the TFA9881 sets the outputs floating. ? after receiving 128 consecutive silence pa ttern audio bytes, the TFA9881 activates the appropriate control setting (see column three of ta b l e 7 ). remark: only the control settings associated with silence patterns containing audio bytes 0xd2, 0xd4, 0xd8, 0xe1, 0xe2, 0xe4 and 0xaa can be set during power-up (before the power-up delay time, t d(on) , has expired). after power-up, only silence patterns containing bytes 0x66 and 0xac will be recognized. all other silence patterns are ignored. all control settings can be activated when: ? control silence patterns are transmitted af ter the TFA9881 has been switched to power-down mode on receipt of a power-down silence pattern (at least 128 consecutive 0xac bytes) ? control silence patterns are transmitted afte r the clock input has stopped and then started again (power-up) if a silence pattern containing more than 128 consecutive silence pattern audio bytes is received during power-up, the tf a9881 outputs will remain floa ting until a different audio byte is received. it will then switch to op erating mode. once th e TFA9881 has powered up, only ?mute? (0x66) and ?power-down? (0xac) control patterns are recognized. all registers are reset to their default values if silence pattern 0xaa is received or the v ddd supply is removed. table 7. silence patterns byte related bytes [1] control settings 0xd1 0xe8/74/3a/1d/8e/47/a3 reserved for test purposes 0xd2 0x69/b4/5a/2d/96/4b/a 5 clip control on; see section 8.4.2 0xd4 0x6a/35/9a/4d/a6/53/a9 gain = ? 3db (v ddp = 2.5 v); see section 8.4.3 0xd8 0x6c/36/1b/8d/c6/63/b1 gain = +3 db (v ddp = 5.0 v); see section 8.4.3 0xe1 0xf0/78/3c/1e/0f/87/c3 slope low (emc); see section 8.4.4 0xe2 0x71/b8/5c/2e/17/8b/c5 dynamic power stage activation (dpsa) off; see section 8.4.5 TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 8 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier [1] the related bytes are the bytes from the first column phase shifted by 1, 2, 3, 4, 5, 6 and 7 bits. [2] a silence pattern containing this byte wi ll be recognized once the TFA9881 has powered up. 8.4.2 clip control TFA9881 clip control is off by default. clip control can be turned on via silence pattern 0xd2 (see section 8.4.1 ). the TFA9881 clips smoothly with clip control on. output power is at maximum with clip control off. 8.4.3 gain selection signal conversion from digital audio in to pwm modulated audio out is independent of supply voltages v ddp and v ddd . at the default gain setting (0 db), the audio output signal level is just below the clipping poin t at a supply voltage of 3.6 v at ? 6 dbfs (peak) input. the TFA9881 supports two further gain settings to support full output power at v ddp = 2.5 v and v ddp = 5.0 v. the gain settings can be selected via silence patterns 0xd4 and 0xd8 (see section 8.4.1 ). ta b l e 9 details the corresponding peak output voltage level at ? 6 dbfs for the three gain settings. [1] r l = load resistance; l l = load inductance. 8.4.4 pwm slope selection the rise and fall times of the pwm output edges can be set to one of two values, as detailed in ta b l e 1 0 . the default setting is ?slope normal? (10 ns with v ddp = 3.6 v). ?slope low? is selected via silence pattern 0xe1 (see section 8.4.1 ). this function is implemented to reduce electro-magnetic interference (emi). 0xe4 0x72/39/9c/4e/27/93/c9 bandwidth extension on (f s = 32 khz or f clk =64f s ); see section 8.4.6 0xaa 0x55 defaults; no mute, reset settings to default 0x66 [2] 0x33/99/cc mute mode (no setting); see section 8.4.7 0xac [2] 0x56/2b/95/ca/65/b2/59 p ower-down mode; see section 8.4.8 table 8. silence pattern recognition bytes 1 to 32 .................... 33 ................................. 127, 128 129 mute mode (outputs floating) control setting activated table 7. silence patterns ?continued byte related bytes [1] control settings table 9. output voltage all parameters are guaranteed for v test =v ddp = 3.6 v; v ddd = 1.8 v; l l = 20 ? h [1] , f clk = 6.144 mhz, t amb = 25 ? c unless otherwise specified. symbol parameter conditions min typ max unit v om peak output voltage at ? 6 dbfs (peak) digital input gain = ? 3db, v ddp = 2.5 v, r l = 4 ? [1] -2.3-v gain = 0 db, v ddp = 3.6 v, r l = 4 ? ; default [1] -3.3-v gain = +3 db, v ddp = 5.0 v, r l = 8 ? , l l =44 ? h [1] -4.7-v TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 9 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 8.4.5 dynamic power stage activation (dpsa) the TFA9881 uses dpsa to regulate current consumption in line with the level of the incoming audio stream. this function switch es off power stage sections that are not needed, reducing current consumption. each of the TFA9881 h-bridge power stages is divided into eight sections. the number of power stage sections activated depends on the level of the incoming audio stream. the thresholds used by the dpsa to determine how many stages are switched on are given in ta b l e 11 . the dpsa signal is used as a reference signal for switching power stage sections on and off. the dpsa signal will rise in tandem with the rectified audio input signal. when the rectif ied audio input signal falls, the dpsa decreases with a negative exponential function , as illustrated in figure 7 . the dpsa function can be switched off via silence pattern 0xe2. when dpsa is off, all power stage sections are activated in operating mode. 8.4.6 bandwidth extension the TFA9881 output spectrum has a sigma-delta converter characteristic. figure 8 illustrates the output power spec trum of the TFA9881 when it is rece iving a pdm input stream without audio content and with bandwid th extension off. the quantization noise is shaped above the band of interest. the band of interest (bandwidth) is determined by the table 10. slope rise and fall times setting rise and fall times of the pwm output edges slope low 40 ns with v ddp = 3.6 v slope normal; default setting 10 ns with v ddp = 3.6 v table 11. dpsa input levels setting number of power stage sections active ? 0.035 ? full scale ( ? 29 dbfs) 1 > 0.035 ? full scale ( ? 29 dbfs) 2 > 0.07 ? full scale ( ? 23 dbfs) 4 > 0.105 ? full scale ( ? 19.5 dbfs) 8 fig 7. dynamic power stage activation 8 sections 4 sections dpsa signal 2 sections 010aaa713 1 section 0.105 full scale 0.07 full scale 0.035 full scale TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 10 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier corner frequency where the noise is increasing. the bandwidth in figure 8 scales with the clock input frequency. this bandwidth c an be extended via the bandwidth extension silence pattern (0xe4; see section 8.4.1 ). the pwm switching frequency also scales with the bandwidth extension setting. the bandwidth and the pwm switching frequency when bandwidth extension is on and off are given in ta b l e 1 2 . remark: the bandwidth extension should be switched off when f clk > 4.1 mhz. 8.4.7 mute mute mode is activated when the mute s ilence pattern (at leas t 32 consecutive 0x66 bytes) is applied on the data input. the TFA9881 remains in mute mode as long as the 0x66 pattern is repeat ed. it will return to operating mode when a pattern other than 0x66 is received. transitions to and from mute mo de occur as soon as the relevant pattern is recognized by the TFA9881 (hard mute and hard unmute). 8.4.8 power-down power-down mode is activated when the power-down silence pattern (at least 128 consecutive 0xac bytes) is applied on the data input. the TFA9881 remains in power-down mode as long as the 0xac pattern is repeated. it will return to operating mode when a pattern other than 0xac is received. table 12. bandwidth extension setting setting bandwidth switching frequency bandwidth extension on bandwidth extension off; default setting fig 8. output power spectrum, f clk = 6.144 mhz f clk 128 -------- - f clk 8 ------- - f clk 256 -------- - f clk 16 ------- - 010aaa709 ?120 ?80 ?40 output (dbfs) ?160 f (hz) 10 10 6 10 5 10 2 10 4 10 3 TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 11 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 8.5 high-pass filter the high-pass filter will block the dc components in the incoming audio stream. the cut-off frequency, f high( ? 3db) , is determined by the clock frequency, and is defined in equation 1 : (1) where k depends on the bandwidth extension setting (see section 8.4.6 ): ? k = 2 if bandwidth extension is off ? k = 1 if bandwidth extension is on f high( ? 3db) is about 7.5 hz at a clock frequency of 6.144 mhz when bandwidth extension is off. the high-pass filter is always enabled. remark: care should be taken when dc dither is applied to the pdm audio input stream. the pdm source should sl owly increase this dc-dither to avoid pop noise. 8.6 protection mechanisms the following protection circuits are included in the TFA9881: ? invalid data protection (idp) ? overtemperature protection (otp) ? overvoltage protection (ovp) ? undervoltage protection (uvp) ? overcurrent protection (ocp) the reaction of the device to fault conditio ns differs depending on the protection circuit involved. 8.6.1 invalid data protection (idp) idp is designed to detect the absence of a da ta input signal. idp is activated when 128 consecutive 0s or 1s are received on the data input. idp is disabled when a pdm stream that doe s not contain 128 consecutive 0s or 1s is received. the output stages are set floating when idp is active. remark: the maximum pdm input modulation depth should be limited to avoid false idp triggering. 8.6.2 overtemperature protection (otp) otp prevents heat damage to the TFA9881. it is triggered when the junction temperature exceeds 130 c. when this happens, the output stages are set floating. otp is cleared automatically via an internal timer (100 ms with f clk = 6.144 mhz), after which the output stages will start to ope rate normally again. f high 3db ? ?? f clk ? 8191 8192 ? ?? ln ? 16 k ? ?? ----------------------------------------------------- - = TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 12 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 8.6.3 supply voltage protection mechanisms (uvp and ovp) uvp is activated, setting the outputs floating, if v ddp drops below the undervoltage protection threshold, v p(uvp) . this transition will be silen t, without pop noise. when the supply voltage rises above v p(uvp) again, the system will be restarted after 100 ms with f clk = 6.144 mhz. ovp is activated, setting the power stages floating, if the supply voltage rises above the overvoltage protection threshold, v p(ovp) . the power stages are re-enabled as soon as the supply voltage drops below v p(ovp) again. the system will be restarted after 100 ms with f clk = 6.144 mhz. note that a supply voltage > 5.5 v may damage the TFA9881. 8.6.4 overcurrent protection (ocp) ocp will detect a short circuit across the load or between one of the amplifier outputs and one of the supply lines. if the output curren t exceeds the overcurrent protection threshold (i o(ocp) ), it will be limited to i o(ocp) while the amplifier outputs are switching (the amplifier is not powered down completely). this is called current limiting. the amplifier can distinguish between an impedance drop at the loudspeaker and a low-ohmic short circuit across the load or to one of the supply lines. the impedance threshold depends on which supply voltage is being used: ? in the event of a short circuit across the load or a short to one of the supply lines, the audio amplifier is switched of f completely. it will tr y to restart again after approximately 100 ms with f clk = 6.144 mhz. if the short-circuit co ndition is still present after this time, this cycle will be repeated. average dissipation will be low because of the short duty cycle. ? in the event of an impedance drop (e.g. du e to dynamic behavior of the loudspeaker), the same protection mechanism will be activated. the maximum output current is again limited to i o(ocp) , but the amplifier will no t switch off completely (thus preventing audio holes from occurring). th is will result in a clipped out put signal without artifacts. TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 13 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 9. internal circuitry table 13. internal circuitry pin symbol equivalent circuit a1 data c1 clk b1 v ddd b2 v ddp a2 lrsel c2 test a3 outb c3 outa 010aaa714 esd b3 a1, c1 010aaa715 b3 b1, b2 esd 010aaa716 b3 b2 a2, c2 esd 010aaa717 b3 b2 a3, c3 TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 14 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 10. limiting values [1] measurements taken on the TFA9881 in a hvson10 package (enginee ring samples) due to handling restrictions with wlcsp9. 11. thermal characteristics [1] measured on a jedec high k-factor test board (standard eia/jesd 51-7). [2] value depends on where measurement is taken on package. table 14. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v ddp power supply voltage on pin v ddp ? 0.3 +5.5 v v ddd digital supply voltage on pin v ddd ? 0.3 +1.95 v t j junction temperature - +150 ?c t stg storage temperature ? 55 +150 ?c t amb ambient temperature ? 40 +85 ?c v x voltage on pin x pins clk and data ? 0.3 +3.6 v pins outa and outb ? 0.6 v ddp + 0.6 v pins test and lrsel ? 0.6 v ddp v v esd electrostatic discharge voltage according to the human body model (hbm) [1] pins outa and outb ? 8+8 kv any other pin ? 2+2 kv according to the charge device model (cdm) [1] ? 500 +500 v according to the machine model (mm) [1] ? 200 +200 v table 15. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air; natural convection jedec test board [1] 128 k/w 2-layer application board 97 k/w ? j-top thermal characterization parameter from junction to top of package [2] 12 k/w TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 15 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 12. characteristics 12.1 dc characteristics [1] r l = load resistance; l l = load inductance. table 16. dc characteristics all parameters are guaranteed for v test = v ddp = 3.6 v; v ddd =1.8 v; r l = 4 ? [1] ; l l = 20 ? h [1] ; f i = 1 khz; f clk = 6.144 mhz; t amb = 25 ? c; default settings, unle ss otherwise specified. symbol parameter conditions min typ max unit v ddp power supply voltage on pin v ddp 2.5 - 5.5 v v ddd digital supply voltage on pin v ddd 1.65 1.8 1.95 v i ddp power supply current operating mode with load -- 1 . 5 1 . 7 m a f clk = 2.048 mhz bandwidth extension on -1.38- ma mute mode 1.1 1.2 ma power-down mode - 0.1 1 ? a i ddd digital supply current operating mode - - 1.35 1.5 ma f clk = 2.048 mhz bandwidth extension on -0.83- ma mute mode - - 1.25 1.4 ma f clk = 2.048 mhz bandwidth extension on -0.78- ma power-down mode clk = 0 v, data = 0 v -28 ? a series resistance output power switches r dson drain-source on-state resistance dpsa off - 125 150 m ? amplifier output pins; pins outa and outb ?v o(offset) ? output offset voltage absolute value - - 3 mv data, clk and lrsel v ih high-level input voltage 0.7v ddd -3.6v v il low-level input voltage - - 0.3v ddd v c i input capacitance - - 3 pf protection t act(th_prot) thermal protection activation temperature 130 - 150 ?c v p(ovp) overvoltage protection supply voltage 5.5 - 5.9 v v p(uvp) undervoltage protection supply voltage 2.3 - 2.5 v i o(ocp) overcurrent protection output current 1.45 - - a TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 16 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 12.2 ac characteristics [1] r l = load resistance; l l = load inductance. [2] inversely proportional to f clk . table 17. ac characteristics all parameters are guaranteed for v test = v ddp = 3.6 v; v ddd =1.8 v; r l = 4 ? [1] ; l l = 20 ? h [1] ; f i = 1 khz; f clk = 6.144 mhz; t amb = 25 ? c; default settings, unle ss otherwise specified. symbol parameter conditions min typ max unit output power p o(rms) rms output power thd + n = 1 % v ddp = 3.6 v, f i = 100 hz - 1.4 - w v ddp = 5.0 v, f i = 100 hz - 2.7 - w thd + n = 1 %; r l = 8 ? ; l l = 44 ? h v ddp = 3.6 v, f i = 100 hz - 0.75 - w v ddp = 5.0 v, f i = 100 hz - 1.45 - w thd + n = 10 % v ddp = 3.6 v, f i = 100 hz - 1.75 - w v ddp = 5.0 v, f i = 100 hz - 3.4 - w thd + n = 10 %; r l = 8 ? ; l l = 44 ? h v ddp = 3.6 v, f i = 100 hz - 0.95 - w v ddp = 5.0 v, f i = 100 hz - 1.85 - w performance ? po output power efficiency p o(rms) = 1.4 w - 90 - % thd+n total harmonic distortion-plus-noise p o(rms) = 100 mw - 0.02 0.1 % v n(o) output noise voltage a-weighted - 24 - ? v s/n signal-to-noise ratio v ddp =5 v; v o = 3.4 v (rms); a-weighted - 103 - db psrr power supply rejection ratio v ripple =200 mv; f ripple = 217 hz - 85 - db v om peak output voltage at ? 6 dbfs (peak) digital input gain = ? 3 db; v ddp = 3.6 v r l =4 ? ; l l = 20 ? h -2.3- v gain = 0 db; v ddp = 3.6 v r l =4 ? ; l l = 20 ? h 3.1 3.3 3.5 v gain = +3 db; v ddp = 5.0 v r l =8 ? ; l l = 44 ? h -4.7- v power-up, power-down and propagation times t d(on) turn-on delay time [2] -- 2ms t d(off) turn-off delay time [2] -- 5 ? s t pd propagation delay [2] -- 55 ? s TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 17 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 12.3 pdm timing characteristics [1] r l = load resistance; l l = load inductance. table 18. pdm timing characteristics all parameters are guaranteed for v test = v ddp = 3.6 v; v ddd =1.8 v; r l = 4 ? [1] ; l l = 20 ? h [1] ; f i = 1 khz; f clk = 6.144 mhz; t amb = 25 ? c; default settings, unle ss otherwise specified. symbol parameter conditions min typ max unit f clk clock frequency 2 - 8 mhz ? clk clock duty cycle 40 - 60 % t h hold time after clock high 7 - - ns after clock low 7 - - ns t su set-up time after clock high 10 - - ns after clock low 10 - - ns fig 9. pdm timing t su(clkh) t h(clkh) t su(clkl) t h(clkl) clk data 010aaa711 TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 18 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 13. application information 13.1 electromagnetic co mpatibility (emc) emc standards define to what degree a (sub)syst em is susceptible to externally imposed electromagnetic influences and to what degree a (sub)system is responsible for emitting electromagnetic signals, when in standby mode or operating mode. emc immunity and emission values are norma lly measured over a frequency range from 180 khz up to 3 ghz. 13.1.1 immunity a major reason why amplifier devices pick up high frequency signals, and (after detection) manifest these in the device's audio band, is the presence of analog circuits inside the device or in the (sub)system. the TFA9881 has digital inputs and digital outputs. comparative tests on a TFA9881-based (sub)system show that the impa ct of externally imposed electromagnetic signals on the device is negligible in both standby and operating modes. 13.1.2 emissions since the TFA9881 is a class-d amplifier with digitally switched outputs in a btl configuration, it can potent ially generate emissions due to the steep edges on the amplifier outputs. external components can be used to suppress these emissions. however, the TFA9881 features built-in slop e control to suppress such emissions by reducing the slew rate of the btl output sig nals. by reducing the slew rate, the emissions are reduced by 10 db when compared with full-speed operation. 13.2 supply decoupling and filtering a ceramic decoupling capacitor of between 4.7 ? f and 10 ? f should be placed close to the TFA9881 for decoupling the v ddp supply. this minimizes the size of the high-frequency current loop, thereby optimizing emc performance. the test bump can be used to route the v ddp bump connection (without using a pcb via). TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 19 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 13.3 typical application diagram (simplified) fig 10. typical stereo application (simplified) TFA9881uk data clk 010aaa712 a1 c1 v ddd b1 baseband processor pdm output 1.8 v cvddd 100 nf battery cvddp 4.7 f outa outb a3 c3 left speaker 4 or 8 gnd b3 lrsel a2 test c2 v ddp b2 TFA9881uk data clk a1 c1 v ddd b1 1.8 v cvddd 100 nf battery cvddp 4.7 f outa outb a3 c3 right speaker 4 or 8 gnd b3 lrsel a2 test c2 v ddp b2 TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 20 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 13.4 curves measured in referen ce design (demonstration board) all measurements were taken with v ddd =1.8v, f clk = 6.144 mhz, clip control off, dpsa off and slope normal, unless otherwise specified. (1) f i = 6 khz. (2) f i = 1 khz. (3) f i = 100 hz. (1) f i = 6 khz. (2) f i = 1 khz. (3) f i = 100 hz. a. v ddp =3.6v,r l =8 ? , l l = 44 ? hb.v ddp =5v,r l =8 ? , l l = 44 ? h (1) f i = 6 khz. (2) f i = 1 khz. (3) f i = 100 hz. (1) f i = 6 khz. (2) f i = 1 khz. (3) f i = 100 hz. c. v ddp =3.6v,r l =4 ? , l l = 20 ? hd.v ddp =5v,r l =4 ? , l l = 20 ? h fig 11. thd+n as a function of output power 001aam634 10 ?1 10 ?2 10 1 10 2 thd+n (%) 10 ?3 p o (w) 10 ?3 10 1 10 ?2 10 ?1 (1) (2) (3) 001aam636 10 ?1 10 ?2 10 1 10 2 thd+n (%) 10 ?3 p o (w) 10 ?3 10 1 10 ?2 10 ?1 (1) (3) (2) 001aam633 10 ?1 10 ?2 10 1 10 2 thd+n (%) 10 ?3 p o (w) 10 ?3 10 1 10 ?2 10 ?1 (1) (2) (3) 001aam635 10 ?1 10 ?2 10 1 10 2 thd+n (%) 10 ?3 p o (w) 10 ?3 10 1 10 ?2 10 ?1 (1) (3) (2) TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 21 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier (1) p o = 500 mw. (2) p o = 100 mw. (1) p o = 500 mw. (2) p o = 100 mw. a. v ddp =3.6v,r l =8 ? , l l = 44 ? hb.v ddp =5v,r l =8 ? , l l = 44 ? h (1) p o = 1 w. (2) p o = 100 mw. (1) p o = 1 w. (2) p o = 100 mw. c. v ddp =3.6v,r l =4 ? , l l = 20 ? hd.v ddp =5v,r l =4 ? , l l = 20 ? h fig 12. thd+n as a function of frequency 001aam638 f i (hz) 10 10 5 10 4 10 2 10 3 10 ?2 10 ?1 1 10 thd+n (%) 10 ?3 (1) (2) 001aam640 f i (hz) 10 10 5 10 4 10 2 10 3 10 ?2 10 ?1 1 10 thd+n (%) 10 ?3 (1) (2) 001aam637 f i (hz) 10 10 5 10 4 10 2 10 3 10 ?2 10 ?1 1 10 thd+n (%) 10 ?3 (1) (2) 001aam639 f i (hz) 10 10 5 10 4 10 2 10 3 10 ?2 10 ?1 1 10 thd+n (%) 10 ?3 (1) (2) TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 22 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier (1) v ripple = 0 v (f ripple = 0 hz). (2) f ripple = 217 hz. (3) f ripple = 1 khz. (4) f ripple = 6 khz. (1) v ripple = 0 v (f ripple = 0 hz). (2) f ripple = 217 hz. (3) f ripple = 1 khz. (4) f ripple = 6 khz. a. v ddp =3.6v,r l =4 ? , l l = 20 ? h, p o = 100 mw v ripple = 200 mv (rms) b. v ddp =5v,r l =4 ? , l l = 20 ? h, p o =100 mw v ripple = 200 mv (rms) fig 13. thd+n + power supply intermodulation distortion as a function of frequency 001aam641 f i (hz) 10 10 5 10 4 10 2 10 3 (4) (3) (2) (1) 10 ?2 10 ?1 1 10 thd+n+imd (%) 10 ?3 001aam642 f i (hz) 10 10 5 10 4 10 2 10 3 (4) (3) (2) (1) 10 ?2 10 ?1 1 10 10 ?3 thd+n+imd (%) v ddp = 3.6 v, r l =4 ? , l l = 20 ? h, p o = 500 mw. (1) v ddp = 3.6 v. (2) v ddp = 5 v. r l =4 ? , l l = 20 ? h, v ripple = 200 mv (rms). fig 14. normalized gain as a function of frequency fig 15. psrr as a function of ripple frequency 001aam643 0 ?0.5 0.5 1.0 g (db) ?1.0 f i (hz) 10 10 5 10 4 10 2 10 3 001aam644 ?70 ?50 ?90 ?30 ?10 psrr (db) ?110 f ripple (hz) 10 10 5 10 4 10 2 10 3 (2) (1) TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 23 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier (1) a-weighted. (2) 20 khz brickwall filter. v ddp =5v, r l =4 ? , l l =20 ? h, reference signal: 3.4 v (rms). fig 16. s/n ratio as a function of output power 001aam632 50 70 30 90 110 s/n ratio (db) 10 p o (w) 10 ?3 10 1 10 ?2 10 ?1 (1) (2) (1) thd+n = 10 %, r l =4 ? , l l = 20 ? h. (2) thd+n = 1 %, r l =4 ? , l l = 20 ? h. (3) thd+n = 10 %, r l =8 ? , l l = 44 ? h. (4) thd+n = 1 %, r l =8 ? , l l = 44 ? h. (1) thd+n = 10 %, r l =4 ? , l l = 20 ? h. (2) thd+n = 1 %, r l =4 ? , l l = 20 ? h. (3) thd+n = 10 %, r l =8 ? , l l = 44 ? h. (4) thd+n = 1 %, r l =8 ? , l l = 44 ? h. a. f i = 100 hz, clip control off b. f i = 100 hz, clip control on fig 17. output power as a function of supply voltage v ddp (v) 26 5 34 001aam649 2 3 1 4 5 p o (w) 0 (1) (2) (3) (4) v ddp (v) 26 5 34 001aam650 2 1 3 4 p o (w) 0 (1) (2) (3) (4) TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 24 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier (1) v ddp =3.6v. (2) v ddp =5v. (1) v ddp =3.6v. (2) v ddp =5v. a. r l =8 ?? , l l =44 ? h, f i = 1 khz, dpsa on b. r l =4 ?? , l l =20 ? h, f i = 1 khz, dpsa on fig 18. power dissipation as a function of output power 001aam647 0.05 0.10 0.15 p (w) 0 p o (w) 10 ?3 10 1 10 ?2 10 ?1 (1) (2) 001aam645 0.2 0.1 0.3 0.4 p (w) 0 p o (w) 10 ?3 10 1 10 ?2 10 ?1 (1) (2) (1) v ddp =3.6v. (2) v ddp =5v. (1) v ddp =3.6v. (2) v ddp =5v. a. r l =8 ?? , l l =44 ? h, f i = 1 khz, dpsa on b. r l =4 ?? , l l =20 ? h, f i = 1 khz, dpsa on fig 19. efficiency as a function of output power p o (w) 0 2.0 1.5 0.5 1.0 001aam648 40 60 20 80 100 (%) 0 (1) (2) p o (w) 0 3.53.0 1.0 2.0 0.5 1.5 2.5 001aam646 40 60 20 80 100 (%) 0 (1) (2) TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 25 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 14. package outline fig 20. package outline TFA9881uk (wlcsp9) references outline version european projection issue date iec jedec jeita TFA9881uk TFA9881uk_po 10-10-06 10-12-16 unit mm max nom min 0.6 0.22 0.18 0.28 0.24 1.3 1.2 1.3 1.2 0.4 0.8 0.01 0.02 a dimensions wlcsp9: wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm TFA9881uk a 1 a 2 0.38 0.34 bdeee 1 0.8 e 2 vw 0.04 y 0 0.5 1 mm scale bump a1 index area b a d e c y x detail x a a 2 a 1 b e 2 e 1 e e ac b v c w bump a1 index area a 123 b c TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 26 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 15. soldering of wlcsp packages 15.1 introduction to soldering wlcsp packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering wlcsp (wafer level chip-size packages) can be found in application note an10439 ?wafer level chip scale package? and in application note an10365 ?surface mount reflow soldering description? . wave soldering is not su itable for this package. all nxp wlcsp packages are lead-free. 15.2 board mounting board mounting of a wlcsp requires several steps: 1. solder paste printing on the pcb 2. component placement with a pick and place machine 3. the reflow soldering itself 15.3 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 21 ) than a pbsn process, thus reducing the process window ? solder paste printing issues, such as sm earing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature), and coo ling down. it is imper ative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 1 9 . moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 21 . table 19. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 27 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 15.3.1 stand off the stand off between the substrate and the chip is determined by: ? the amount of printed solder on the substrate ? the size of the solder land on the substrate ? the bump height on the chip the higher the stand off, the better the stresses are released due to tec (thermal expansion coefficient) differences between substrate and chip. 15.3.2 quality of solder joint a flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. the surface of the joint should be smooth and the shape symmetrical. the soldered joints on a chip should be uniform. voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. no failures have been found to be related to these voids. solder joint inspection after reflow can be done with x-ray to monitor defects such as bridging, open circuits and voids. 15.3.3 rework in general, rework is not recommended. by rework we mean the process of removing the chip from the substrate and replacing it with a new chip. if a chip is removed from the substrate, most solder balls of the chip will be damaged. in that case it is recommended not to re-use the chip again. msl: moisture sensitivity level fig 21. temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 28 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier device removal can be done when the substrate is heated until it is certain that all solder joints are molten. the chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. removing the device must be done using plastic tweezers, because me tal tweezers can damage the silicon. the surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill remove d. when a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. apply flux on the bumps at the chip side as well as on the solder pads on the substrate. place and align the new chip while viewing with a microscope. to reflow the solder, use the solder profile shown in application note an10365 ?surface mount reflow soldering description? . 15.3.4 cleaning cleaning can be done after reflow soldering. TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 29 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 16. revision history table 20. revision history document id release date data sheet status change notice supersedes TFA9881 v.1 20110105 preliminary data sheet - - TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 30 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier 17. legal information 17.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 17.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 17.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification. TFA9881 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. preliminary data sheet rev. 1 ? 5 january 2011 31 of 32 nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 17.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 18. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com nxp semiconductors TFA9881 3.4 w pdm input class-d audio amplifier ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 5 january 2011 document identifier: TFA9881 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 19. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 ordering information . . . . . . . . . . . . . . . . . . . . . 3 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 functional description . . . . . . . . . . . . . . . . . . . 5 8.1 mode selection and interfacin g . . . . . . . . . . . . . 5 8.2 digital stereo pdm audio input . . . . . . . . . . . . . 5 8.3 power up/down sequence . . . . . . . . . . . . . . . . 6 8.4 control settings. . . . . . . . . . . . . . . . . . . . . . . . . 7 8.4.1 silence pattern recognition . . . . . . . . . . . . . . . . 7 8.4.2 clip control . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.4.3 gain selection . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.4.4 pwm slope selection . . . . . . . . . . . . . . . . . . . . 8 8.4.5 dynamic power stage ac tivation (dpsa). . . . . 9 8.4.6 bandwidth extension. . . . . . . . . . . . . . . . . . . . . 9 8.4.7 mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8.4.8 power-down . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8.5 high-pass filter . . . . . . . . . . . . . . . . . . . . . . . . 10 8.6 protection mechanisms . . . . . . . . . . . . . . . . . 11 8.6.1 invalid data protection (idp) . . . . . . . . . . . . . 11 8.6.2 overtemperature protecti on (otp) . . . . . . . . 11 8.6.3 supply voltage protection mechanisms (uvp and ovp) . . . . . . . . . . . . . . . . . . . . . . . 11 8.6.4 overcurrent protection (ocp) . . . . . . . . . . . . 12 9 internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 13 10 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14 11 thermal characteristics . . . . . . . . . . . . . . . . . 14 12 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 15 12.1 dc characteristics . . . . . . . . . . . . . . . . . . . . . 15 12.2 ac characteristics. . . . . . . . . . . . . . . . . . . . . . 16 12.3 pdm timing characteristics . . . . . . . . . . . . . . . 17 13 application information. . . . . . . . . . . . . . . . . . 18 13.1 electromagnetic compatibility (emc) . . . . . . . 18 13.1.1 immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 13.1.2 emissions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 13.2 supply decoupling and filtering. . . . . . . . . . . . 18 13.3 typical application diagram (simplified) . . . . . 19 13.4 curves measured in reference design (demonstration board) . . . . . . . . . . . . . . . . . . 20 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . 25 15 soldering of wlcsp packages . . . . . . . . . . . 26 15.1 introduction to soldering wlcsp packages . 26 15.2 board mounting . . . . . . . . . . . . . . . . . . . . . . . 26 15.3 reflow soldering . . . . . . . . . . . . . . . . . . . . . . 26 15.3.1 stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 15.3.2 quality of solder joint . . . . . . . . . . . . . . . . . . . 27 15.3.3 rework. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 15.3.4 cleaning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 16 revision history . . . . . . . . . . . . . . . . . . . . . . . 29 17 legal information . . . . . . . . . . . . . . . . . . . . . . 30 17.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 30 17.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 17.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 30 17.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 31 18 contact information . . . . . . . . . . . . . . . . . . . . 31 19 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 |
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